EC-01-Kit It is an NB-IoT development board developed by Ai-Thinker The main chip scheme used in the NB-IoT part is EC616S.The ultra-integrated NB-IoT SoC development board supports ultra-low power consumption and fully supportsthe3GPP Rel14 NB-IoT standard, making it an ultra-cost-effective NB-IoT chip

It has the following characteristics (NB-IoT)

1. Are integrated with RF transceivers, PA, RF filters, antenna switches and power management.
2. Excellent communication performance and stability in a variety of wireless environments
3. Excellent power performance in various modes (PSM, DRX, eDRX, connected mode)
4. Unique MCU mode, providing lower operating current and shorter wake uptime

Features:

1. Processor: Cortex-M3，
2. Support: MPU
3. Configurable: CPU frequency, Max 204MHz
4. 8-Channel DMA
5. Storage: 4MB NOR Flash on chip
6. System: Flexible Configuration Support 1.8/2.8/3.3V IO
7. Peripheral: 8 GPIO(Include TX0RX0 AND TX1RX1), 2 UART,2 I2C, 5 PWM, 4 Channel, 12-bit AUXADC, 1 SIM Booth
8. Low power consumption
9. Communication: Fully support 3GPP R14 NB-IoT
10. Power supply voltage: support 5V Micro USB or 3.3V pin supply

Packages Includes:

1 x Ai-Thinker EC-01-Kit NB+IOT Development Board

Ai WB2 12F Kit is a development board designed for Ai WB2 12F modules. Ai WB2 12F is a Wi-Fi & Bluetooth module developed by Shenzhen Ai Thinker Technology Co., Ltd. The module is equipped with a BL602 chip as the core processor and supports Wi-Fi 802.11b/g/n protocol and BLE 5.0 protocol. The BL602 chip has a built-in 32-bit RISC CPU with low power consumption, 276KB RAM, and a wide range of peripheral interfaces, including SDIO, SPI, UART, VDC, IR remote, PWM, ADC, DAC, PIR, and GPIO. It can be widely used in the Internet of Things (IoT), mobile devices, wearable electronic devices, smart homes, and other fields.

Features:

1. DIP 30 package
2. Supports IEEE 802.11 b/g/n protocol
3. Wi Fi security supports WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3
4. Supports 20MHz bandwidth with a maximum speed of 72.2 Mbps
5. Bluetooth BLE 5.0, Bluetooth Mesh
6. Supports Station + BLE mode, Station + SoftAP + BLE mode
7. Supports 32 bit RISC CPU and 276KB RAM
8. Secure Startup. Images with ECC 256 signatures are supported
9. Supports real time AES decryption (OTFAD) in QSPI and SPI Flash, and supports AES 128 CTR mode
10. Supports AES 128, 192, and 256 bit encryption engines
11. Supports SHA 1/224/256
12. Real random number generator (TRNG)
13. The public key accelerator (PKA) supports large numbers of basic operations. The software provides application interfaces such as signature and verification
14. Supports SDIO, SPI, UART, VDC, IR remote, PWM, ADC, DAC, PIR, and GPIO
15. Integrated Wi Fi MAC/BB/RF/PA/LNA/Bluetooth
16. Supports multiple sleep modes with a deep sleep current of 12μA
17. Quick Start of universal AT commands
18. Supports secondary development and integrates Windows and Linux development environments

Specifications:

1. Model: Ai WB2 12F Kit
2. Package: DIP 30
3. Size: 49.66*25.40(±0.2)mm
4. Antenna On Board: PCB antenna
5. Frequency: 2400 ~ 2483.5MHz
6. Operation temperature: 40℃ ~ 85℃
7. Storage environment: 40℃ ~ 125℃, < 90%RH
8. Power supply Support voltage: 3.3V or 5V,
9. Power supply current: ≥500mA
10. Interfaces: UART/GPIO/ADC/PWM/I2C/SPI I/O 11
11. UART: rate Default value: 115200 bps
12. Bluetooth: BLE 5.0
13. Security: WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3
14. Flash: Default: 4MByte

Package Includes:

1 x Ai-Thinker Ai-WB2-12F Kit

ESP-C3-M1-I is a WiFi module developed by Shenzhen Ai-Thinker Technology Co., Ltd. The module’s core processor chip ESP32-C3 is a highly integrated low-power WiFi and Bluetooth system-on-chip (SoC), designed for the Internet of Things (IoT), mobile devices, wearable electronic devices, smart homes application, etc. The ESP32-C3 chip has industry-leading low power consumption performance and radiofrequency performance, and supports WiFi IEEE802.11b/g/n protocol and BLE 5.0. The chip is equipped with a RISC-V 32-bit single-core processor with a working frequency of up to160MHz.

Support secondary development without using other microcontrollers or processors. The chip has built-in 400 KB SRAM, 384 KB ROM, 8KB RTC SRAM, and built-in 4MBFlash. The chip supports a variety of low power consumption working states, which can meet the power consumption requirements of various application scenarios. The chip’s unique features such as fine clock gating function, dynamic voltage clock frequency adjustment function, and RF output power adjustable function can achieve the best balance between communication distance, communication rate and power consumption. The ESP-C3-M1-I module provides a wealth of peripheral interfaces, including UART, PWM, SPI, I2S, I2C, ADC, temperature sensor and up to 15 IO interfaces. The ESP-C3-M1-I module has a variety of unique hardware security mechanisms. The
hardware encryption accelerator supports AES, SHA and RSA algorithms. Among them, RNG, HMAC and digital signature (Digital Signature) modules provide more security features. Other security features include Flash encryption and secure boot (secure boot) signature verification. The perfect security mechanism enables the chip to be perfectly applied to various encryption products. The ESP-C3-M1-I module supports low-power Bluetooth: Bluetooth5, Bluetooth mesh. Bluetooth rate support: 125Kbps, 500Kbps, 1Mbps, 2Mbps. Support broadcast extension, multi-broadcasting, channel selection

Features: 

1. Support WiFi 802.11b/g/n, 1T1R mode data rate up to 150Mbps
2. Support BLE5.0, rate support: 125Kbps, 500Kbps, 1Mbps, 2Mbps
3. ISC-V 32-bit single-core processor, supports a clock frequency of up to 160 MHz, has 400KB SRAM, 384 KB ROM, 8KB RTC SRAM
4. Support UART/GPIO/ADC/PWM/I2C/I2S/SPI interface, temperature sensor, pulse
   counter
5. SMD-61 Package
6. Integrated WiFi MAC/BB/RF/PA/LNA/Bluetooth
7. Support multiple sleep modes, deep sleep current is less than 5uA
8. Serial port rate up to 5Mbps
9. Support STA/AP/STA+AP mode and promiscuous mode
10. Support Smart Config (APP)/AirKiss (WeChat) for Android and IOS one-click networkconfiguration
11. Support serial port local upgrade and remote firmware upgrade (FOTA)
12. General AT commands can be used quickly
13. Support secondary development, integrated Windows and Linux development environment
14. About Flash: ESP-C3-M1-I chip has built-in 4MByte Flash by default

Packages includes:

1 x Ai-Thinker ESP-C3-M1 Wi-Fi + BLE Module

Ai-WB2-01S is a Wi-Fi & BLE module developed by Shenzhen Ai-Thinker Technology Co., Ltd. This module is equipped with BL602 chip as the core processor and supports Wi-Fi 802.11b/g/n protocol and BLE 5.0 protocol. The BL602 chip has a built-in 32-bit RISC CPU with low power consumption and 276KB RAM. It can be widely used in the Internet of Things (IoT), mobile devices, wearable electronic devices, smart homes, and other fields.

Features:

1. DIP-8 package
2. Supports IEEE 802.11 B/g/n protocol
3. Wi-Fi security supports WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3
4. Supports 20MHz bandwidth with a maximum speed of 72.2 Mbps.
5. Bluetooth 5.0, Bluetooth Mesh
6. Supports Station + BLE mode, Station + SoftAP + BLE mode
7. Supports 32-bit RISC CPU and 276KB RAM
8. Secure Startup supports Images with ECC-256 signatures
9. Supports real-time AES decryption (OTFAD) in QSPI and SPI Flash, and supports AES
   128 CTR mode
10. Supports AES 128, 192, and 256-bit encryption engines
11. Supports SHA-1/224/256
12. Support True Random Number Generator (TRNG)
13. Public Key Accelerator (PKA), supports a large number of basic operations, and software provides
    a signature, verification, and other application program interface
14. Supports UART, PWM,ADC, and GPIO
15. Integrated Wi-Fi MAC/BB/RF/PA/LNA/BT
16. Supports multiple sleep modes with a deep sleep current of 12μA
17. Universal AT instruction for a quick start
18. Supports secondary development and integrates Windows and Linux development
    environments

Specifications:

1. Model: Ai-WB2-01S
2. Package: DIP-8
3. Size: 14.5*24.5*11.2(±0.2)mm
4. Antenna on-board: PCB antenna
5. Frequency: 2400 ~ 2483.5MHz
6. Operating temperature: -40℃ ~ 85℃
7. Storage temperature: -40℃ ~ 125℃, < 90%R
8. Power supply Power supply voltage: 2.7V ~ 3.6V, power supply current
   ≥500mA
9. Interface: UART/GPIO/ADC/PWM
10. IO: 3
11. UART: rate Default value: 115200 bps
12. Security: WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3
13. Flash: Default 2MByte Support expansion

Package Includes:

1 x Ai-Thinker Ai-WB2-01S Module

Ai WB2 13 is a Wi Fi& BT module developed by Shenzhen Ai Thinker Technology Co., LTD. The module is equipped with BL602 chip as the core processor and supports Wi Fi 802.11b/ g/n protocol and BLE 5.0 protocol. The BL602 chip has a low power 32 bit RISC CPU, 276KB RAM, and a wealth of peripheral interfaces, including SDIO, SPI, UART, I2C, IR Remote, PWM, ADC, DAC, PIR and GPIO. It can be widely used in Internet of Things (IoT), mobile devices, wearable electronic devices, smart home and other fields.

Features:

1. The package is SMD 18
2. Support IEEE 802.11 b/g/n protocol
3. Wi Fi Security Support WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3 ◼ Support 20MHz bandwidth and Max rate is 72.2 Mbps
4. Bluetooth BLE 5.0,Bluetooth Mesh
5. Support Station + BLEStation + SoftAP + BLE
6. Support 32 bit RISC CPU276KB RAM
7. Secure startup, supports mirroring with ECC 256 signature
8. Support QSPI/SPI Flash On The Fly AES Decryption (OTFAD), support AES 128 CTR
9. Support AES 128/192/256 bit encryption engine
10. Support SHA 1/224/256
11. Support true Random number generator (TRNG)
12. Public key Accelerator (PKA), support large number basic operations, software provides signature, verification and other application program interface
13. Support SDIOSPIUARTI2CIR remotePWMADCDACPIRGPIO etc
14. Integrated Wi Fi MAC/BB/RF/PA/LNA/BT
15. Support a variety of sleep modes, deep sleep current 12μA
16. Universal AT instruction for quick start
17. Support secondary development, integrated Windows, Linux development environment

Specifications:

1. Model: Ai WB2 13
2. Package: SMD 18
3. Size: 20.0*18.0*3.1(±0.2)mm
4. Antenna on board: PCB antenna
5. Frequency: 2400 ~ 2483.5MHz
6. Operating temperature: 40℃ ~ 85℃
7. Storage temperature 40℃ ~ 125℃, < 90%RH
8. Power supply Support voltage: 2.7V ~ 3.6V
9. Supply current ≥500mA
10. Interface UART/GPIO/ADC/PWM/I2C/SPI IO 11 UART rate Default 115200 bps
11. Security: WPS/WEP/WPA/WPA2 Personal/WPA2 Enterprise/WPA3
12. Flash: Default 4MByteMAX support 16MByte

Package Includes:

1 x Ai-Thinker Ai-WB2-13 Module

Ca-01 is an ultra-small package LTE Cat.1 bis module launched by Ai-Thinker. It adopts Unigroup’s UIS8910 platform and supports LTE 3GPP Rel.13 technology. It is a 4G full Netcom module that can adapt to different operators and products to ensure maximum flexibility in product design.

Features: 

1. Support Cat.1
2. Support VoLTE
3. Support 1.4 ~ 20MHz RF bandwidth
4. LTE-TDD: uplink and downlink configuration 2
5. Maximum upstream rate 2Mbps, maximum downstream rate 8Mbps
6. LTE-TDD: uplink and downlink configuration 1
7. Maximum upstream rate 4Mbps, maximum downstream rate 6Mbps
8. Network protocol features
9. Support: TCP/UDP/PPP/FTP/HTTP/NITZCMUXINDIS/NTP/ HTTPS/
10. In development: SMTP/SMTPS/MMS/DTMF
11. USIM card interface
12. Support USIM / SIM card: 1.8V and 3V
13. USB interface
14. Compatible with USB2.0 (only supports slave mode), the data transfer rate is up to 480Mbps
15. Used for AT commands, data transmission, software debugging, software upgrade
16. USB virtual serial port driver: support USB driver under Windows 7 / 8.1 / 10, Linux 2.6.x / 3.x / 4.1, Android 4.x / 5.x /6.x17.x and other operating systems
17. Serial port

Interface:

1. 1 USB 2.0 high speed interface (up to 480Mbps)
2. 1.8V/3.0V (U) SIM card interface
3. 1 NETLIGHT interface (NET_STATUS and NET_MODE)
4. 2 analog voice input
5. 2 analog voice output
6. 3 UART interfaces
7. 1 SPI interface
8. 1 SPI LCD interface
9. 1 SPI Camera interface
10. 1 MMC interface
11. PWRKEY (active low)
12. Support 6*6 array keyboard
13. 2 ADC interfaces
14. Electrical parameters-Output power: LTE-TDD: Class3(23dBm+1/-3dB); LTE-FDD: Class3(23dBm+-2dB);
15. General features: 3GPP E-UTRA Release 13;
16. Bandwidth: 1.4/3/5/10/15/20MHz;
17. Package: stamp hole + LGA;
18. Weight: about 2.6g;

Package Includes: 

1 x Ai-Thinker CA-01 Dev. Board